***********************************************************************
***********           PANJIT International Inc.             ***********
***********************************************************************
*Nev 30, 2018                                                         *
*                                                                     *
*This SPICE Model describes the characteristics of a typical device   *
*and does not respresent the specification. Designer should refer to  *
*the same type name data sheet for specification limits.              *
***********************************************************************
*$
.subckt BC847BPN-AU EP BP CN EN EB CP
qn CN BN EN nbjt
qp CP BP EP pbjt
.model pbjt pnp
*****DC curve parameter***
+  is = 5.285e-14	  nf = 1.052		  nr = 1.052
+ ikf = 4.069e-1
+ ise = 2.285e-14	  ne = 1.464		 isc = 5.002-12		  nc = 1.339
+  bf = 354.01		  nk = 9.905e-1
+  rb = 8.719		  rc = 2.0197
*****capacitance parameter***
+ cje = 1.316e-11	 vje = 9.866e-1		 mje = 4.556e-1
+ cjc = 7.227e-12	 vjc = 2.991e-1		 mjc = 3.522e-1
*****thermal parameter***
+ xtb = 1.182		  eg = 1.148
+trb1 = 2.047e-2
.model bjt npn
*****DC curve parameter***
+  is = 8.189e-13	  nf = 1.200		  nr = 1.207
+ ikf = 8.146e-2	 ikr = 3.518e-2		 vaf = 18.91
+ ise = 5.672e-14	  ne = 1.560		 isc = 1.548e-13		  nc = 3.2264
+  bf = 182.9		  br = 2.648		  nk = 6.452e-1
+  rb = 4.5735		  rc = 7.241e-1
*****capacitance parameter***
+ cje = 1.632e-11	 vje = 7.595e-1		 mje = 3.599e-1
+ cjc = 4.623e-12	 vjc = 4.535e-1		 mjc = 3.734e-1
*****thermal parameter***
+ xtb = 1.00		  eg = 9.808e-1
+trb1 = 3.743e-2
.ends
*$
